Koch Chemie Micro Cut Pad polishing pad

Koch Chemie Micro Cut Pad polishing pad

High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01.

The short height of 23mm creates low torsion forces, very good handling and the highest level of stability.

The special density of the foam material enables long-lasting compression hardness during polishing.

The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.

The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.

The colourful non-woven material, suitable for polishing, ensures process safety.

Ø 

150 x 23 mm

126 x 23 mm

76 x 23 mm

Compression hardness: 10

Abrasiveness: 5